- 资讯公开站gnews_tsmc_industry
Samsung steps up HBM cooling as TSMC expands CoWoS - digitimes
- 资讯公开站Digitimes
Samsung steps up HBM cooling as TSMC expands CoWoS
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management challenges.
- 资讯公开站Digitimes
DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks
As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast enough is becoming increasingly critical to f…
- 资讯公开站gnews_trendforce
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028, Says TrendForce - TrendForce
- 资讯公开站google_news_tsmc
CoWoS与面板封装需求会推动ASX进入下一增长阶段吗？
Will CoWoS & Panel Packaging Demand Drive ASX's Next Growth Phase? - TradingView
- 资讯公开站Digitimes
DIGITIMES：AI扩展正从芯片微缩转向系统集成
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
台积电表示，AI性能提升的下一阶段将更多依赖多芯片、内存与先进封装的系统级整合，而非单一芯片微缩，这可能重塑半导体竞争格局。
- 资讯公开站google_news_tsmc
CoWoS-L 到 2028 年仍将是领先的 AI 芯片封装技术
CoWoS-L to Remain Leading AI Chip Packaging Technology Through 2028 - EE Times Asia
- 资讯公开站Digitimes
专栏：AI改变平衡，内存与逻辑碰撞
Column: Memory and logic collide as AI shifts the balance
随着HBM成本接近GPU-HBM CoWoS封装的一半，内存还能被视为AI计算的被动组件吗？答案要回到“内存墙”，这一挑战塑造了近半个世纪的半导体发展。
- 资讯公开站Digitimes
SK海力士携手台积电测试HBM5，HBM4进入英伟达下一代平台
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform
SK海力士9月28日称已用台积电CoWoS封装验证其HBM5内存，意味着下一代之后的产品已与代工厂展开合作，而其HBM4才刚被集成进英伟达Vera Rubin平台。
- 资讯公开站rss_digitimes
CoWoS 背后（上）——一场 0% 良率危机如何促成台积电首个先进封装胜局
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
在近期 DIGITIMES 播客的一次采访中，国际微电子与封装学会（IMAPS）主席、曾长期担任台积电先进封装高管的郑信普博士回顾了 CoWoS 的早期开发历程。在本系列两部分的第一篇中，郑信普详述了一场关键的薄中介层危机如何迫使台积电与赛灵思携手创新，从而为现代先进封装奠定基础。
- 资讯公开站google_news_tsmc
CoWoS 背后（上）——0% 良率危机如何促成台积电首个先进封装胜利
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win - digitimes
- 资讯公开站google_news_tsmc
CoWoS 幕后（下）：台积电如何将小众封装实验变成行业标准
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard - digitimes
- 资讯公开站Digitimes
CoWoS幕后（下）：台积电如何将小众封装实验变成行业标准
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
随着芯片设计进入AI时代，异质集成推动台积电、三星、英特尔等代工巨头将先进前段制程能力引入后段封装。IMAPS主席郑新普博士在访谈第二部分中讲述这一历程。
- 资讯公开站Digitimes
CoWoS幕后（上）：0%良率危机如何成就台积电首个先进封装突破
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
IMAPS主席、台积电前先进封装资深高管郑新普博士在DIGITIMES播客访谈中回顾CoWoS早期开发，讲述0%良率危机如何促成台积电首个先进封装成功。
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS®小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电与博通以全球首个2倍光罩尺寸中介层增强CoWoS平台
TSMC and Broadcom Enhance the CoWoS Platform with World’s First 2X Reticle Size Interposer - pr.tsmc.com
- 资讯公开站google_news_tsmc
报道：AI芯片短缺波及竞争对手，台积电到2028年将把CoWoS产能翻倍
Report: TSMC to Double CoWoS Capacity by 2028 as AI Chip Shortage Spills Over to Rivals - Wccftech
- 资讯公开站google_news_tsmc
台积电拟在高雄建迷你循环以加速CoWoS设备验证，传考虑友达厂址用于CoPoS
[News] TSMC Plans Mini-Loop at Kaohsiung to Speed CoWoS Tool Validation; Reportedly Eyes AUO Site for CoPoS - TrendForce
TrendForce报道，台积电计划在高雄设立迷你循环（mini-loop），以加快CoWoS设备的验证流程。报道还称，台积电据传正考虑将友达（AUO）的厂址用于CoPoS。
- 资讯公开站google_news_tsmc_site
CoWoS® - 台湾积体电路制造股份有限公司 - TSMC 3DFabric
CoWoS® - Taiwan Semiconductor Manufacturing Company Limited - TSMC 3DFabric
- 资讯公开站google_news_tsmc_site
TSMC 完成全球首个集成 JEDEC Wide I/O 移动 DRAM 接口的 CoWoS™ 测试芯片流片
TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing Hsinchu, Taiwan R.O.C. - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电 CoWoS 永续行动：废料变黄金，回收晶圆节省 7 亿新台币
TSMC's CoWoS® Sustainability Drive: Turning Waste into Wealth, Saving NT$700 Million with Recycled Wafers - TSMC
- 资讯公开站google_news_tsmc_site
先进有机中介层（CoWoS®-R）封装的可靠性表现 - TSMC
Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages - TSMC
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS®小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电与博通以全球首款2倍光罩尺寸中介层增强CoWoS平台
TSMC and Broadcom Enhance the CoWoS Platform with World’s First 2X Reticle Size Interposer - pr.tsmc.com
