- 论文公开站arXiv
VISTA: A Visual Harness for Reasoning in an Interactive World
We show that multimodal models possess strong reasoning abilities and that an appropriate harness can unlock their potential to solve tasks across diverse interactive environments. We introduce VISTA, a visual harness th…
- 资讯公开站Digitimes
Nanya Technology wins approval for Southern 3D packaging plant
The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's plan to enter the Pingtung area…
- 资讯公开站Entrepreneur
Workers Are Managing AI Bots — Without Getting Manager Pay
A new report reveals that more workers than ever are managing AI bots without a raise or title change.
- 资讯公开站gnews_trendforce
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028, Says TrendForce - TrendForce
- 资讯公开站gnews_trendforce
[News] ASE’s SPIL Reportedly Nears Arizona Expansion as TSMC, Amkor Step Up U.S. Advanced Packaging Push - TrendForce
- 资讯公开站rss_plastics_today
Virginia Tech Researchers Develop Ring-Shaped Polymers for Sustainable Packaging
Researchers at Virginia Tech have developed degradable, high-performance packaging materials by controlling polymer chain architecture rather than changing chemical components, offering potential solutions for sustainabl…
- 资讯公开站rss_plastics_today
APR Launches Digital Tool for Packaging Recyclability
APR's new Design Assessment Tool automates recyclability evaluations for plastic packaging, helping companies comply with expanding EPR laws and labeling requirements.
- 资讯公开站google_news_tsmc
CoWoS与面板封装需求会推动ASX进入下一增长阶段吗？
Will CoWoS & Panel Packaging Demand Drive ASX's Next Growth Phase? - TradingView
- 资讯公开站Digitimes
Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity
Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction is intended to establish a new …
- 资讯公开站Digitimes
Huawei makes Mate 90 showcase for its Tau chip strategy
Huawei unveiled its Mate 90 smartphone series on October 1, with Richard Yu, Huawei executive director and chairman of the Consumer BG, introducing the new devices alongside a new generation of in-house chips and imaging…
- 资讯公开站Digitimes
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced packaging.
- 资讯公开站Digitimes
Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years
Machvision said its "dual-track, four-line" strategy has entered an early growth phase as demand for AI servers, high-speed transmission, and advanced packaging continues to rise. The company said visibility for semicond…
- 资讯公开站Digitimes
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling capacity of mobile devices.
- 论文公开站arXiv
去除时间捷径可改进非侵入式脑机文本解码
Removing Timing Shortcuts Improves Non-Invasive Brain-to-Text
研究发现，多项报道的非侵入式脑信号词解码性能提升，在完全不用脑数据的情况下也能复现。在 d'Ascoli 等人（2025）的工作中，受试者感知连续语音的脑活动时间序列被分段处理。
- 资讯公开站Digitimes
荣耀以 Magic V6 加入台湾折叠屏手机竞争
Honor joins Taiwan foldable phone race with Magic V6
荣耀于9月30日在台湾推出首款折叠屏手机 Magic V6，距其2026年4月正式进入当地市场约半年。公司希望这款高端旗舰强化品牌并提升市场份额。
- 资讯公开站Digitimes
DIGITIMES：AI扩展正从芯片微缩转向系统集成
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
台积电表示，AI性能提升的下一阶段将更多依赖多芯片、内存与先进封装的系统级整合，而非单一芯片微缩，这可能重塑半导体竞争格局。
- 资讯公开站Digitimes
AI芯片封装需求遇劳资阻力：日月光56亿新台币购厂引发罢工投票
AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote
日月光7月30日宣布斥资约56.7亿新台币（约1.78亿美元）向零食厂商乖乖购入中坜工业区土地厂房以扩产，此举引发劳方罢工投票。
- 资讯公开站Digitimes
应用材料与铠侠合作开发AI时代内存技术
Applied Materials and Kioxia team up on AI-era memory tech
应用材料与铠侠在硅谷研究基地联手开发下一代内存技术，或影响全球AI系统。合作旨在提升内存密度、速度与能效。
- 资讯公开站google_news_tsmc
CoWoS-L 到 2028 年仍将是领先的 AI 芯片封装技术
CoWoS-L to Remain Leading AI Chip Packaging Technology Through 2028 - EE Times Asia
- 资讯公开站Digitimes
苹果A20 Pro弃用PoP内存封装，转向WMCM
Apple A20 Pro ditches PoP memory packaging for WMCM
拆解分析显示，苹果A20 Pro芯片已放弃传统堆叠封装（PoP），改用晶圆级多芯片模块（WMCM），内存与处理器裸片并排布局，有望提升封装良率和散热性能。
- 资讯公开站EE Times
AI推动更大更密封装，给设备商带来新挑战
AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers
在A*STAR的Innovate Together 2026上，行业专家探讨了面向AI的封装、混合键合、光学互连和工艺控制。
- 资讯公开站Digitimes
SK海力士恢复向Winpac外包DDR4、DDR5封装订单
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
SK海力士已恢复向韩国外包半导体封测（OSAT）供应商Winpac外包DRAM封装，重启了2023年终止的供应关系，因该内存制造商增加了外部合作伙伴处理的倒装芯片封装量。
- 资讯公开站Digitimes
AI热潮推动显示厂商以玻璃基板和Micro LED进军半导体
AI boom draws display makers into semiconductors with glass core substrates and Micro LED
AI推动半导体进入新增长周期，为传统面板厂商创造进入半导体的机会。这些公司正将业务延伸至先进封装和光学连接等新兴领域。
- 资讯公开站Digitimes
晶圆代工2.0营收创纪录，增长扩展至台积电以外
Foundry 2.0 revenue hits record as growth spreads beyond TSMC
2026年第二季度全球晶圆代工2.0市场营收达966亿美元创纪录，同比增长25%、环比增长11%，数据中心相关半导体需求从先进制程扩展至网络、电源管理和成熟制程。
- 资讯公开站Digitimes
林德获Sanand土地，全球材料供应商竞相为印度首座晶圆厂本地化
Linde secures Sanand land as global materials suppliers race to localize for India's first fabs
印度芯片计划正吸引供应链材料环节落地。随着塔塔电子Dholera晶圆厂和Sanand封测集群推进，美日韩的工业气体、湿化学品和光刻胶供应商正加速布局。
