- 资讯公开站Digitimes
Semicon 2.0 widens focus beyond fabs: Dassault Systèmes pitches virtual twins to India's chipmakers
Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's semiconductor mission. The French ind…
- 资讯公开站Digitimes
Hua Yang, Zeiss launch COSMA-M for chip metrology
Hua Yang Precision Machinery has teamed up with Zeiss to launch COSMA-M, a high-precision measurement system aimed at the semiconductor metrology market as demand surges from AI, high-performance computing (HPC), and adv…
- 资讯公开站MIT Technology Review
Weight-loss drugs show signs of slowing biological aging, say drugmakers
Popular weight-loss drugs may do more than help people shed pounds. They might also melt away the years. Drug giants Eli Lilly and Novo Nordisk say patients taking their drugs age less quickly, according to readouts from…
- 资讯公开站Nature News
How to mobilize the agile science needed in a crisis
- 资讯公开站gnews_semi_org
Advanced Packaging and Material Characterization for Microelectronics (Virtual Training, Asia & EU) - SEMI.org
- 资讯公开站Digitimes
Behind the US$4.2 trillion revenue gap in AI infrastructure
AI data center plans and computing demand are expanding far faster than physical infrastructure can be built, creating a widening gap between planned and actually deployed compute. A review tracking construction progress…
- 资讯公开站Electrek
Six Flags has installed one of the largest solar carports in the US
Six Flags Magic Mountain is putting its parking lots to work with a new 12.37-megawatt (MW) solar installation – California’s largest solar carport. It’s expected to generate enough electricity each year to offset the an…
- 资讯公开站Digitimes
Foxconn move smart long-term care pilot into real care settings
Foxconn and Shiangbao Longterm Care Group have advanced their smart long-term care collaboration into proof-of-concept trials at three care sites in Taiwan. The pilot, launched in November 2025, is designed to address ri…
- 资讯公开站Supply Chain Dive
How restaurants can mitigate rising fuel costs
Evaluating delivery frequency and leveraging route optimization and scenario planning can help brands combat higher transportation expenses, experts say.
- 资讯公开站Digitimes
AMD's Lisa Su back in Taiwan as AI capacity crunch spreads beyond TSMC
AMD CEO Lisa Su arrived in Taiwan on October 5 for a lightning visit, less than five months after her May trip. No major public events are scheduled, but meetings with key suppliers are planned. Industry sources said her…
- 资讯公开站Digitimes
Taiwan's GIS targets optical communications growth with fresh laser-packaging capacity
General Interface Solution (GIS) Holding is gaining traction in optical communications and other new products despite weak consumer electronics demand caused by rising memory prices. Its laser-source packaging and testin…
- 资讯公开站Digitimes
Micronex plans Sanand lead-frame plant as India expands chip packaging supply chain
Micronex Technology plans to build a semiconductor lead-frame factory in Sanand, Gujarat, seeking to localize a packaging component as India expands its chip assembly and testing industry. The startup's agreement with Ka…
- 资讯公开站Digitimes
Applied Materials, Besi broaden packaging partnership for AI chip integration
Applied Materials and BE Semiconductor Industries (Besi) are expanding their partnership to address the increasingly complex connections between AI chips, extending joint development beyond hybrid bonding into a broader …
- 资讯公开站Digitimes
Nanya Tech expands 3D OSAT to chase HBM-like demand
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The company said it has won approval from t…
- 资讯公开站Digitimes
Podcast highlights: TSMC Texas plant talk is premature, Intel 18A hits backfiring criticism
This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push as AI workloads drive demand for hybrid…
- 资讯公开站MIT Technology Review
The Download: a biological de-aging contest and why LLMs don’t reason
This is today’s edition of The Download, our weekday newsletter that provides a daily dose of what’s going on in the world of technology. A new contest pits competitors against each other in a race to biologi…
- 资讯公开站rss_arxiv_cs_ai
Conflicting Supervision Moves Commitment, Not Capability: A 12.29{\sigma} arrangement effect that is exactly zero under a convention-agnostic score
arXiv:2610.00234v1 Announce Type: new Abstract: "Train a model on the same problems written under two incompatible conventions, both correct, and ask what the ordering of that data writes into the parameters. The learni…
- 资讯公开站Semiconductor Engineering
Chip Industry Week In Review
CFETs push scaling beyond 10 angstroms; physical AI M&A and funding; AI data centers drive new power/packaging investments; new Spectre-v2 attack targets JIT compilers; photonics moves closer to compute; quantum HW;…
- 资讯公开站Digitimes
BMW to make 20% of senior management redundant with AI
BMW AG said at its capital markets day on September 30 that it plans to use artificial intelligence (AI) to help streamline one-fifth of management roles by mid-2027. As BMW pushes to boost organizational agility through…
- 资讯公开站Digitimes
China turns to 3D packaging to push AI performance beyond front-end scaling limits
Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have historically sat at the summit of se…
- 资讯公开站Digitimes
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced Semiconductor Engineering's (ASE's) e…
- 资讯公开站Digitimes
JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support to help JCET scale its manufacturing f…
- 资讯公开站Digitimes
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply current into the thousands of ampe…
- 资讯公开站Digitimes
Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED optical communications move clos…
- 论文公开站arXiv
The Missing Primitive: Diagnosing and Repairing Mathematical Reasoning in Large Language Models
While Large Language Models (LLMs) have demonstrated striking capabilities on frontier mathematical problems, it remains unclear whether they possess the structural mathematical understanding underlying their solutions. …
