- 资讯公开站Digitimes
Kingston retains 62% memory module share as B2B AI demand surges
Memory module maker Kingston Technology announced that, according to TrendForce's revenue rankings, it held a 62% share of the global third-party dynamic random-access memory (DRAM) module market in 2025, retaining the t…
- 资讯公开站Semiconductor Engineering
Programmable Memory Controller Eases Adoption of New DRAM Techniques (ETH Zürich, CISPA, NYU)
Researchers at ETH Zürich, CISPA, and New York University published a technical paper titled “Terracotta: Enabling the Adoption of New DRAM Techniques via a Flexible DRAM Interface and Memory Controller.” Abstract Excerp…
- 资讯公开站EE Times
CXL-Connected MRAM Address AI Storage Latency
- 资讯公开站Semiconductor Engineering
Chip Industry Technical Paper Roundup: Oct. 6
Low-contact-resistance WSe₂ transistors; backside clock meshes for 2nm GAAFETs; row-parallel processing in DRAM; HBF for high-throughput LLM serving; formal security analysis of CAN XL; abstraction and validation from ph…
- 资讯公开站Semiconductor Engineering
Row-Parallel DRAM Computing Cuts Data-Reorganization Overhead (Syracuse, FAU, TU Dresden)
Researchers at Syracuse University, Friedrich-Alexander-Universität Erlangen-Nürnberg, and TU Dresden published a technical paper titled “RAPID: Row-Parallel Arithmetic Processing in DRAM.” Abstract Excerpt: “Processing-…
- 资讯公开站Digitimes
LPDDR5X supply tightens around AI servers, squeezing PCs, smartphones into 2027
AI data center demand for LPDDR5X DRAM has continued to expand through 2026 and is expected to remain strong into 2027, tightening supply for PCs and smartphones and keeping device prices under pressure.
- 资讯公开站Digitimes
Samsung reportedly turns to Winbond for TV DRAM as legacy memory supply tightens
Samsung Electronics plans to buy DRAM from Taiwan's Winbond Electronics starting in 2027 and is considering using it in about half of its televisions, South Korean publication The Bell reported, citing industry sources. …
- 资讯公开站Digitimes
Micron ramps up HBM capacity at Taiwan's four major sites
Micron Technology's revenue and profit for the fourth quarter of fiscal 2026 both beat expectations, and the company expects capacity supply to be even tighter in 2027 and 2028 than in 2026. Donghui Lu, vice president of…
- 资讯公开站Digitimes
Micron expands global fabs, calls on Taiwanese suppliers to go overseas
AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India. Donghui Lu, vice president of Micron's …
- 资讯公开站Digitimes
Micron hikes 2027 HBM prices after missing 2026 memory surge on fixed contracts
Micron Technology has sharply raised 2027 prices for high-bandwidth memory (HBM), the stacked DRAM packaged with AI accelerators. The increase comes after a year in which fixed contract prices left HBM largely outside th…
- 资讯公开站gnews_sk_hynix
HBM明年将消耗全球DRAM晶圆产能的30% - 朝鲜日报
HBM to Consume 30% of Global DRAM Wafer Capacity Next Year - 조선일보
- 资讯公开站Digitimes
SK海力士恢复向Winpac外包DDR4、DDR5封装订单
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
SK海力士已恢复向韩国外包半导体封测（OSAT）供应商Winpac外包DRAM封装，重启了2023年终止的供应关系，因该内存制造商增加了外部合作伙伴处理的倒装芯片封装量。
- 资讯公开站Digitimes
评论：市场收紧之际，中国DRAM产能面临哪些风险？
Commentary: What risks does China's DRAM capacity face amid tightening market?
- 资讯公开站Digitimes
长鑫存储52亿美元扩建深化中国国产DRAM设备推进
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
中国最大DRAM制造商长鑫存储（CXMT）正加速349亿元人民币（52亿美元）扩建，瞄准芯片制造设备、内部测试和更紧密的存储供应链控制。
- 资讯公开站Digitimes
长鑫存储扩产契合兆易创新DRAM需求，强化中国存储供应链
CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
- 资讯公开站Digitimes
中国3D DRAM攻关：从实验室到晶圆厂及未来路径
Inside China's 3D DRAM push: from lab to fab, and the road ahead
中国3D DRAM研发正从早期研究转向晶圆工艺与设备，参与方包括中科院微电子所、北京超弦存储器研究院、长鑫存储及设备厂商。
- 资讯公开站Digitimes
长鑫存储将投资 52 亿美元用于研发和测试，DRAM 供应持续紧张
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
中国长鑫存储（CXMT）计划投资 349 亿元人民币（约 52 亿美元）用于技术研发和增加后端 DRAM 测试产能，以在内存供应紧张和价格走强之际扩大投资。
- 资讯公开站gnews_micron_ir
美光推出全球首款面向数据中心基础设施的高容量256GB LPDRAM SOCAMM2，树立新标杆
Micron Sets New Benchmark With the World's First High-Capacity 256GB LPDRAM SOCAMM2 for Data Center Infrastructure - investors.micron.com
- 资讯公开站rss_digitimes
三星调整DRAM路线图，优先推进B1b混合键合用于D0a、HBM5
Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
三星电子正在调整其下一代动态随机存取存储器（DRAM）路线图，将B1b晶圆对晶圆（W2W）混合键合技术从特定项目开发提升为D0a的核心技术，D0a是三星首个sub-10nm DRAM世代。业界观察人士认为，三星提前推动B1b DRAM商业化，也可能惠及其下一代高带宽内存（HBM）产品，包括HBM5。
- 资讯公开站Digitimes
三星加速P5工厂，HBM将占DRAM产能近30%
HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
随着HBM和传统DRAM供应趋紧，三星电子加快新存储产能布局。预计到2027年，HBM将占DRAM厂商总晶圆产能的近30%，高于目前的约20%。
- 资讯公开站Digitimes
分析：马斯克的AI安全主张与监管相冲突
Analysis: Elon Musk's AI safety push clashes with regulation
全球AI进入剧烈动荡期，顶尖研究者警告头部实验室在“拿我们的生命赌博”，一位Anthropic安全研究员称未来10年AI消灭人类的概率超过10%。
- 资讯公开站Ars Technica
Xbox大幅重组继续"重置"：动视获Halo，Obsidian并入Bethesda
Shuffling the deck chairs: Xbox continues its "reset" with dramatic restructuring
摘要显示，Xbox 正推进一轮被外界称为「重置」的重大内部重组：动视（Activision）获得 Halo 系列，黑曜石（Obsidian）被划入 Bethesda 体系，此外还有更多内部架构调整。报道以「挪动甲板上的椅子」作比，暗示此次变动多为组织层面重组，具体产品与开发计划影响尚不明朗。
意义：Xbox 第一方工作室归属重划，可能影响 Halo 与黑曜石后续作品的开发节奏与发行策略，值得关注主机与订阅制生态的开发者留意。
- 资讯公开站EE Times
中国DRAM厂商CXMT有意进军NAND闪存
China’s DRAM Specialist CXMT Eyes NAND Flash Entry
摘要显示，中国DRAM专业厂商长鑫存储（CXMT）正考虑进入NAND闪存领域，与长江存储（YMTC）互相拓展对方的主场，以把握AI驱动的存储芯片短缺机遇。此举若成真，将改变中国存储产业双雄的竞争格局。
意义：若CXMT进军NAND，将加剧存储芯片竞争，影响AI服务器供应链与国产替代进程。
- 资讯公开站google_news_tsmc_site
TSMC 完成全球首个集成 JEDEC Wide I/O 移动 DRAM 接口的 CoWoS™ 测试芯片流片
TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface - pr.tsmc.com
- 资讯公开站EE Times
AI需求将使DRAM市场持续承压
AI Demand Will Keep DRAM Market Under Pressure
摘要显示，AI 基础设施支出正推动 DRAM 短缺，这一局面将持续至 2027 年，并导致消费电子厂商在供应链优先级中进一步靠后。报道未给出具体供需数据或厂商表态，但指出 AI 需求是主要压力来源。
意义：DRAM 供应紧张将推高内存成本，影响 AI 服务器与消费电子产能，开发者需关注硬件成本与交付周期。
