- 资讯公开站Digitimes
Apple, Qualcomm renew patent deal, iPhone modem shift deepens
Qualcomm announced on September 24 that it has renewed its global patent licensing agreement with Apple, with the new contract set to take effect on April 1, 2027. The terms and value of the deal were not disclosed, but …
- 资讯公开站Digitimes
Qualcomm takes Arm to trial again, with billions in royalties at stake
Qualcomm and Arm opened a five-day trial in US federal court in Delaware on October 5, with Qualcomm seeking to stop paying Arm royalties for up to five years, a remedy potentially worth billions of dollars. The dispute …
- 资讯公开站Digitimes
Qualcomm licenses Huawei's LogicFolding patents as US curbs reshape chip ties
Qualcomm has agreed to license patents related to Huawei's LogicFolding chipmaking technology as part of a broad multiyear patent agreement, expanding the companies' intellectual-property ties even as US export restricti…
- 资讯公开站Digitimes
LB Semicon expands power chip capacity as Qualcomm production ramps up
South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon is expanding power semiconductor backend capacity at its Gumi plant as it steps up efforts to reduce its reliance on display driver integ…
- 资讯公开站Digitimes
Podcast highlights: TSMC Texas plant talk is premature, Intel 18A hits backfiring criticism
This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push as AI workloads drive demand for hybrid…
- 资讯公开站EE Times
Qualcomm Doubles Down on Agentic AI at Snapdragon Summit 2026
- 资讯公开站Digitimes
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling capacity of mobile devices.
- 资讯公开站Digitimes
高通称PC芯片短缺可控，价格波动冲击更大
Qualcomm says PC chip shortages are manageable; price swings hit harder
高通计算与游戏业务高级副总裁Kedar Kondap表示，PC行业最大挑战不是零部件短缺，而是内存等部件价格异常大幅波动。
- 资讯公开站Digitimes
苹果A20 Pro弃用PoP内存封装，转向WMCM
Apple A20 Pro ditches PoP memory packaging for WMCM
拆解分析显示，苹果A20 Pro芯片已放弃传统堆叠封装（PoP），改用晶圆级多芯片模块（WMCM），内存与处理器裸片并排布局，有望提升封装良率和散热性能。
- 资讯公开站Digitimes
Googlebook与QwenBook将智能体AI带入PC系统层，开启芯片新机遇
Googlebook, QwenBook bring agentic AI to the PC system layer, opening new chip opportunities
- 资讯公开站Digitimes
高通看好智能眼镜引领AI可穿戴设备热潮；AI别针、吊坠紧随其后
Qualcomm sees smart glasses leading AI wearables boom; AI pins, pendants follow
根据高通XR、可穿戴设备和个人AI高级副总裁兼总经理Ziad Asghar的说法，在智能手机之外的个人AI设备中，智能眼镜仍是增长最快的类别。他在2026年骁龙峰会媒体问答中表示。
- 资讯公开站Digitimes
高通与Liquid AI在骁龙峰会展示端侧AI潜力
Qualcomm, Liquid AI tout on-device AI potential at Snapdragon Summit
高通于9月22日至24日在夏威夷毛伊岛举办骁龙峰会2026。第二天主题演讲中，高通总裁兼CEO安蒙与Liquid AI联合创始人兼CEO Hasani对谈。
- 资讯公开站rss_robot_report
高通将收购 PickNik Robotics 并保持 MoveIt 开源
Qualcomm to acquire PickNik Robotics and keep MoveIt open-source
高通计划将 Dragonwing 和 Arduino 平台与 MoveIt 开源操作框架进行整合。该消息最初发布于 The Robot Report。
- 资讯公开站CNX Software
高通发布骁龙X2系列Linux开发者预览版
Qualcomm releases Linux developer preview for the Snapdragon X2 Series
摘要显示，高通面向骁龙 X2 系列 Armv9 笔记本 SoC 发布了 Linux「早期开发者预览版」，目标用户为发行版维护者、工具链开发者、内核贡献者和硬件适配工程师。高通面向移动 PC 的新处理器通常仅支持 Windows，其 Linux 维护历史表现不一：2024 年曾与 Linaro 合作展示骁龙 X Elite 的 Debian 12 与上游化，但据反馈支持并不完整，不及 x86 平台水平。
意义：Arm 笔记本 Linux 生态长期受限于厂商支持不足，该预览版为内核与发行版开发者提供了提前适配 X2 平台的入口。
- 资讯公开站CNX Software
华硕Ascent QN10迷你PC搭载高通骁龙X2 Elite 18核Armv9处理器
ASUS Ascent QN10 mini PC is powered by Qualcomm Snapdragon X2 Elite 18-core Armv9 processor
摘要显示，华硕 Ascent QN10 是首款采用高通骁龙 X2 Elite（Glymur 8480B / X2E-88-100）18 核 Armv9 处理器的迷你主机，面向 Windows Copilot+ PC，AI 算力达 80 TOPS。配置最高 32GB LPDDR5 内存与 512GB 至 2TB NVMe SSD，提供 HDMI 加三个 USB4（40 Gbps）共四路视频输出，并具备 2.5GbE、WiFi 7、音频接口…
意义：Arm 架构迷你主机首次用上骁龙 X2 Elite，80 TOPS 与多路 USB4 显示输出为端侧 AI 开发和多屏办公提供新选择。
- 资讯公开站EE Times
面向楼宇与园区安全的边缘优先架构
Edge-first Architectures for Building and Campus Safety and Security
该内容探讨高通技术公司的边缘优先架构如何将AI处理直接带到摄像头、网关和本地系统，用于楼宇与园区的安全防护。
意义：边缘AI在安防场景的落地路径，对端侧推理与本地化部署的开发者有参考价值。
- 资讯公开站CNX Software
高通推出 Dragonwing Q-2390 和 IQ-2390，面向消费与工业 AIoT
Qualcomm introduces Dragonwing Q-2390 and IQ-2390 for consumer and industrial AIoT applications
高通推出面向消费、商用与工业 AIoT 的 Dragonwing Q-2390 和 IQ-2390 处理器，采用 1 核 Cortex-A78 加 3 核 Cortex-A55 架构，主频最高 1.9GHz，可选配最高 600MHz 的 SiFive E61 RISC-V 实时核心。
意义：高通以 Cortex-A78/A55 加可选 RISC-V 实时核的组合切入 AIoT 边缘市场，为开发者提供兼顾通用算力与实时控制的统一平台。
