- 资讯公开站Semiconductor Engineering
Chip Industry Technical Paper Roundup: Oct. 6
Low-contact-resistance WSe₂ transistors; backside clock meshes for 2nm GAAFETs; row-parallel processing in DRAM; HBF for high-throughput LLM serving; formal security analysis of CAN XL; abstraction and validation from ph…
- 资讯公开站Digitimes
Samsung ramps Exynos 2700 wafer production as second-gen 2nm rollout advances
Samsung Electronics has reportedly begun front-end wafer mass production of its next-generation Exynos 2700 mobile application processor, with production volume planned at more than 10% above that of the Exynos 2600 as t…
- 资讯公开站Semiconductor Engineering
Backside Clock Meshes Cut Skew and Power in 2nm Nanosheets (UCSC)
Researchers at the University of California, Santa Cruz published a technical paper titled “Design Space Exploration of Backside Clock Meshes for 2 nm GAAFET BSPDN Technology.” Abstract Excerpt: “Clock meshes are used in…
- 资讯公开站Digitimes
Samsung's Galaxy Tab S12 taps MediaTek Dimensity 9500 as 2nm successor arrives
MediaTek announced on September 30 that its flagship Dimensity 9500 chip powers Samsung's new Galaxy Tab S12 Ultra and Galaxy Tab S12+ tablets. The deal continues a long-running partnership between the two companies acro…
- 资讯公开站Digitimes
三星HBM4提振代工业务，2nm推进持续
Samsung Foundry gets boost from HBM4 as 2nm push continues
三星电子HBM4量产为其代工业务带来及时提振，内存需求上升转化为4nm逻辑产线更多订单。
- 资讯公开站gnews_tsmc_industry
富国银行看好台积电2nm扩产潜力，提振半导体设备前景
Wells Fargo Highlights TSMC's 2nm Expansion Potential, Boosting Semiconductor Equipment Outlook (TSM) - GuruFocus
- 资讯公开站Digitimes
全球芯片竞赛中，新加坡押注关键成熟技术
In global semiconductor race, Singapore bets on critical, mature technologies
在全球半导体供应链持续重构之际，新加坡聚焦先进封装、异质集成、硅光子和光互连，力图发挥近六十年制造与供应链经验。
- 资讯公开站Digitimes
三星晶圆代工2纳米良率逼近60%，转向能效以争取客户
Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers
据报道，三星电子晶圆代工业务已将其2纳米SF2工艺良率提升至近60%，目前正将工程重点转向能效及其他成熟度验证。此举是其争取先进制程大客户的更广泛努力的一部分。
- 资讯公开站gnews_tsmc_industry
EDN 报道：TSMC 2nm 晶圆产能将超过此前预期
TSMC 2nm wafer capacity to exceed earlier estimates, EDN reports - Yahoo Finance
据 EDN 报道，TSMC 的 2nm 晶圆产能预计将超过此前的预估。该报道由 Yahoo Finance 转载。
- 资讯公开站google_news_tsmc
EDN 报道：TSMC 2nm 晶圆产能将超过此前预期
TSMC 2nm wafer capacity to exceed earlier estimates, EDN reports - Investing.com
- 资讯公开站google_news_tsmc
报道：TSMC 将 2nm 晶圆产量展望上调 20%
TSMC increases 2nm wafer production outlook by 20%: report - Seeking Alpha
- 资讯公开站EE Times
GUC发布2nm 16 Gbps HBM4E IP
GUC Announces 2nm 16 Gbps HBM4E IP
摘要显示，GUC 宣布推出面向 2nm 工艺的 HBM4E PHY 与控制器 IP，数据传输速率达 16 Gbps，并已被客户用于 AI ASIC 设计。该 IP 定位为设计就绪（design-ready），意味着客户可直接集成到芯片设计中，缩短开发周期。
意义：2nm 工艺下高速 HBM4E IP 的商用化，将加速 AI ASIC 的内存带宽升级，为开发者提供可集成的现成方案。
- 资讯公开站CNX Software
Nordic nRF54LC10A——休眠电流低于50nA的微型蓝牙LE与802.15.4 SoC
Nordic nRF54LC10A – A tiny Bluetooth LE and 802.15.4 SoC with sub-50 nA hibernation mode
摘要显示，Nordic Semiconductor 扩展 nRF54L 系列，推出 nRF54LC10A，相比 nRF54L15 内存更少、外设更精简，支持带信道探测的蓝牙 LE 及面向 Thread、Zigbee、Matter 的 IEEE 802.15.4。该芯片基于 22nm 工艺，集成 128 MHz Arm Cortex-M33 与多协议 2.4 GHz 射频，并具备低于 50 nA 的休眠模式，可降低带电池出厂设备在仓储与运…
意义：为低功耗物联网终端提供更小内存与更低休眠电流的多协议无线方案，有利于延长仓储与运输阶段的电池寿命。
- 资讯公开站Semiconductor Engineering
芯片行业一周回顾
Chip Industry Week In Review
摘要显示，本期芯片行业周报涵盖多项动态：一笔重大内存交易、AI基础设施峰会新闻、美国芯片产能计划、2nm及以下制程进展、华为的芯片攻势、面向数据中心和AI SoC的RoT解决方案、中国设备制造商份额提升、印度芯片建设、麦肯锡技术趋势、重大融资轮次以及欧洲AI基础设施缺口。
意义：快速了解全球芯片行业关键动向，涵盖内存、先进制程、AI基础设施及地缘竞争，有助于开发者把握供应链与技术趋势。
