- 资讯公开站Semiconductor Engineering
Row-Parallel DRAM Computing Cuts Data-Reorganization Overhead (Syracuse, FAU, TU Dresden)
Researchers at Syracuse University, Friedrich-Alexander-Universität Erlangen-Nürnberg, and TU Dresden published a technical paper titled “RAPID: Row-Parallel Arithmetic Processing in DRAM.” Abstract Excerpt: “Processing-…
- 资讯公开站Semiconductor Engineering
Backside Clock Meshes Cut Skew and Power in 2nm Nanosheets (UCSC)
Researchers at the University of California, Santa Cruz published a technical paper titled “Design Space Exploration of Backside Clock Meshes for 2 nm GAAFET BSPDN Technology.” Abstract Excerpt: “Clock meshes are used in…
- 资讯公开站EE Times
Trusted AI: Why Intelligence Alone Isn’t Enough
- 资讯公开站Power Electronics News
What Makes a Power Semiconductor Ready for Space, Hybrid SiC/Silicon SSCBs, Infineon’s PSOC Control C3 Performance Line:
Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on What Makes a Power Semiconductor Ready for Space, Hybrid SiC/Silicon SSCBs, and Infineon’s PSOC Control C3 Performance Line…
- 资讯公开站Digitimes
Samsung opens Boston quantum design lab to expand US research push
Samsung Electronics has set up a Quantum Design Lab in the Boston area of Massachusetts and started hiring for it, marking a new phase in the company's push into quantum computing. The effort places the South Korean tech…
- 资讯公开站Semiconductor Engineering
The Agentic AI Super Cycle
- 资讯公开站Semiconductor Engineering
Extreme Environments Push Chips To Their Breaking Point
- 资讯公开站Digitimes
Kyushu's chip expo expands as Japan adds a chip design focus
Japan's Kyushu Semiconductor Industry Exhibition, known as K-Semi, grew 36% at this year's edition in Fukuoka, held from September 30 to October 1, 2026, as chip makers expanded their presence in Kyushu. The event also a…
- 资讯公开站Digitimes
CHPT posts record quarterly revenue as chip test demand rises
Chunghwa Precision Test Tech (CHPT), a supplier of semiconductor test interfaces, posted record revenue for September and the third quarter of 2026 as demand for AI-related chip testing kept capacity utilization high. Re…
- 资讯公开站Digitimes
Taiwan teams accelerate 2D semiconductor transfer with published research in Nature
Researchers in Taiwan are intensifying efforts to turn 2D semiconductor materials from basic science into practical applications, with a series of studies published in Nature. The latest work, published in the October 1 …
- 资讯公开站Digitimes
Huawei counters chip-node limits with Ascend, SuperPoD and τ law
Huawei is increasingly framing its semiconductor strategy around a simple constraint: if advanced process nodes remain limited, more performance must come from architecture, interconnect and system-level efficiency.
- 资讯公开站Digitimes
China's ASML DUV stockpile spurs calls to close export-control loophole
Chinese semiconductor manufacturers have stockpiled hundreds of immersion deep ultraviolet (DUV) lithography systems worth billions of dollars in recent years, prompting a Washington think tank to call for tighter export…
- 资讯公开站Digitimes
Japan's strategic push to reclaim silicon supremacy with Rapidus
In a major effort to rebuild its national semiconductor industry, Japanese contract chipmaker Rapidus plans to partner with 17 domestic and international design firms to broaden its potential customer base and help clien…
- 资讯公开站Digitimes
ESMT 3Q26 revenue jumps 58%, sets another record
Elite Semiconductor Microelectronics Technology (ESMT) reported September consolidated revenue of NT$7.461 billion (approx. US$234 million), up 470.23% from NT$1.308 billion a year earlier but down 5.62% from August. For…
- 资讯公开站Digitimes
Exclusive: A*STAR IME's Yu-chieh Chien targets next-gen SiC through 8-inch R&D, reliability gains
Singapore is building a semiconductor R&D hub by attracting both multinational investment and overseas research talent. Dr Yu-chieh Chien, a Taiwanese scientist at the Agency for Science, Technology and Research's In…
- 资讯公开站Digitimes
Micronex plans Sanand lead-frame plant as India expands chip packaging supply chain
Micronex Technology plans to build a semiconductor lead-frame factory in Sanand, Gujarat, seeking to localize a packaging component as India expands its chip assembly and testing industry. The startup's agreement with Ka…
- 资讯公开站Digitimes
Applied Materials, Besi broaden packaging partnership for AI chip integration
Applied Materials and BE Semiconductor Industries (Besi) are expanding their partnership to address the increasingly complex connections between AI chips, extending joint development beyond hybrid bonding into a broader …
- 资讯公开站Digitimes
South Korea's AI chip budget goes unspent through August
South Korea's government is pushing to join the "global top three AI powers," but the AI semiconductor development program led by the Ministry of Trade, Industry and Resources (MOTIR) had spent nothing by the end of Augu…
- 资讯公开站Digitimes
Weekly news roundup: Musk looms large as AI chip boom drives capacity expansion and geopolitical risks
Across the week, Taiwan-linked semiconductor groups and their partners continued expanding capacity, while AI demand, export controls, and financing structures shaped the industry outlook. ASML's push to raise EUV output…
- 资讯公开站Digitimes
India roundup: India deepens its role in global technology supply chains
India is expanding its role across semiconductors, electronics and digital services, as new investment rules, supply-chain localization and Apple initiatives highlight both the country's progress and remaining constraint…
- 资讯公开站Semiconductor Engineering
Tracing Hardware Design From Physical Devices to RTL (Infineon, TU Munich)
Researchers at Infineon Technologies and Technical University of Munich published a technical paper titled “From Physical Devices to RTL Models: Abstraction and Validation in Hardware Engineering.” Abstract: “This paper …
- 资讯公开站Digitimes
Synopsys reshapes EDA, IP business models as AI shifts revenue from seats to customer output
Synopsys is reshaping how it monetizes its two core businesses, electronic design automation (EDA) and semiconductor IP, as AI transforms engineering workflows. Announcements at the company's 2026 Investor Day in New Yor…
- 资讯公开站Semiconductor Engineering
HBF for High-Throughput LLM Serving (UC Berkeley, FuriosaAI)
Researchers at the UC Berkeley and FuriosaAI published a technical paper titled “Characterizing High Bandwidth Flash for LLM Serving.” Abstract: “Large language model (LLM) serving requires substantial memory to store mo…
- 资讯公开站Semiconductor Engineering
Formal Automotive Security Analysis Of CAN XL (Georgia Tech, QCRI, Purdue)
Researchers at Georgia Institute of Technology, Qatar Computing Research Institute, and Purdue University published a technical paper titled “A Formal Security Analysis of CAN XL.” Abstract: “For decades, the Contr…
- 资讯公开站Power Electronics News
What Makes a Power Semiconductor Ready for Space
Infineon's Eric Faraci explains how the company's engineers turn mission requirements into radiation-hardness ratings for its silicon MOSFETs and GaN HEMTs, from total-dose and heavy-ion testing to production lot accepta…
