- 资讯公开站google_news_tsmc
报道：台积电将于2027年上调晶圆价格3%-6%
TSMC to Raise Wafer Prices 3%-6% in 2027: Report - Taiwan Semiconductor (NYSE:TSM) - Benzinga
据报道，台积电（NYSE:TSM）计划于2027年将晶圆价格上调3%-6%。该消息来自Benzinga的报道。
- 资讯公开站Semiconductor Engineering
芯片行业一周回顾
Chip Industry Week In Review
摘要显示，本周芯片行业动态包括：AI智能体在芯片设计中的应用进一步深入；中国加大AI算力与存储投入；设备与关键材料的芯片供应链趋紧；台积电合作伙伴加速推进；集成电路向太空领域拓展；光学技术、神经超分辨率、汽车后量子密码取得进展；普渡大学与伊利诺伊大学厄巴纳-香槟分校合作开展劳动力培训。
意义：AI智能体渗透芯片设计、中国强化算力自主、供应链收紧，直接影响芯片研发效率与全球产业格局。
- 资讯公开站EE Times
台积电设计生态演进：用 AI 塑造 AI 未来
Inside TSMC’s Evolving Design Ecosystem: Shaping the Future of AI, with AI
摘要显示，台积电在EE Times上分享了其开放创新平台生态的最新进展，并提出利用台积电AI设计套件（TSMC AI Design Kit）支持AI驱动的代理式工作流的愿景。文章标题强调以AI塑造AI的未来，但摘要未披露具体技术细节、性能数据或合作方信息。
意义：台积电设计生态向AI代理工作流延伸，可能影响芯片设计工具链与EDA生态走向。
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS®小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电与博通以全球首个2倍光罩尺寸中介层增强CoWoS平台
TSMC and Broadcom Enhance the CoWoS Platform with World’s First 2X Reticle Size Interposer - pr.tsmc.com
- 资讯公开站google_news_tsmc
报道：AI芯片短缺波及竞争对手，台积电到2028年将把CoWoS产能翻倍
Report: TSMC to Double CoWoS Capacity by 2028 as AI Chip Shortage Spills Over to Rivals - Wccftech
- 资讯公开站google_news_tsmc
台积电2030年High-NA EUV押注的关键不在机器，而在掩膜
TSMC's 2030 High-NA EUV Bet Isn't About the Machine — It's About the Mask - finance.biggo.com
- 资讯公开站google_news_tsmc
台积电拟在高雄建迷你循环以加速CoWoS设备验证，传考虑友达厂址用于CoPoS
[News] TSMC Plans Mini-Loop at Kaohsiung to Speed CoWoS Tool Validation; Reportedly Eyes AUO Site for CoPoS - TrendForce
TrendForce报道，台积电计划在高雄设立迷你循环（mini-loop），以加快CoWoS设备的验证流程。报道还称，台积电据传正考虑将友达（AUO）的厂址用于CoPoS。
- 资讯公开站google_news_tsmc
传 TSMC 1.4nm 节点宏大计划：四座工厂据称 2028 年第二季度投产，每片晶圆价格仅略高于 N2
TSMC Reportedly Has Grand Plans For Its 1.4nm Node With Four Plants Said To Be Operational By Q2 2028, Price Per Wafer Surprisingly Only Marginally Higher Than N2 - Wccftech
据 Wccftech 报道，TSMC 对其 1.4nm 节点有宏大计划，据称将建四座工厂，预计到 2028 年第二季度投入运营。报道称，该节点每片晶圆的价格令人意外地仅略高于 N2。
- 资讯公开站google_news_asml
台积电与ASML宣布合作推动High-NA EUV大尺寸光掩模行业转型
TSMC and ASML Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV - ASML
- 资讯公开站google_news_tsmc_site
CoWoS® - 台湾积体电路制造股份有限公司 - TSMC 3DFabric
CoWoS® - Taiwan Semiconductor Manufacturing Company Limited - TSMC 3DFabric
- 资讯公开站google_news_tsmc_site
TSMC 完成全球首个集成 JEDEC Wide I/O 移动 DRAM 接口的 CoWoS™ 测试芯片流片
TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing Hsinchu, Taiwan R.O.C. - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电 CoWoS 永续行动：废料变黄金，回收晶圆节省 7 亿新台币
TSMC's CoWoS® Sustainability Drive: Turning Waste into Wealth, Saving NT$700 Million with Recycled Wafers - TSMC
- 资讯公开站google_news_tsmc_site
先进有机中介层（CoWoS®-R）封装的可靠性表现 - TSMC
Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages - TSMC
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS®小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电与博通以全球首款2倍光罩尺寸中介层增强CoWoS平台
TSMC and Broadcom Enhance the CoWoS Platform with World’s First 2X Reticle Size Interposer - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
TSMC 20nm与CoWoS™设计基础设施就绪
TSMC 20nm and CoWoS™ Design Infrastructure Ready|Taiwan Semiconductor Manufacturing Company Limited - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
CoWoS® - 台灣積體電路製造股份有限公司 - TSMC
- 资讯公开站google_news_tsmc_site
Xilinx 与 TSMC 基于 CoWoS 的全部 28nm 全可编程 3D IC 系列实现量产
Xilinx and TSMC Reach Volume Production on all 28nm CoWoS™-based All Programmable 3D IC Families - pr.tsmc.com
- 资讯公开站google_news_tsmc
联发科推出采用台积电最先进技术的新款移动芯片 - 路透社
MediaTek launches new mobile chip using TSMC's most advanced technology - Reuters
- 资讯公开站google_news_tsmc
传英特尔与台积电均有意拉拢台湾友达，先进封装话题带动股价放量大涨逾9%
Taiwan's AUO reportedly courted by both Intel and TSMC; advanced packaging buzz sends shares surging over 9% on heavy volume - finance.biggo.com
- 资讯公开站google_news_tsmc
AMD 通知合作伙伴涨价 10%，台积电晶圆成本上升或挤压 2026 年第四季度 Ryzen CPU 产品线
AMD Notifies Partners of 10% Price Hike As Increased TSMC Wafer Costs Could Squeeze Ryzen CPU Lineup For Q4 2026 - Wccftech
- 资讯公开站google_news_tsmc
台积电百埔计划：先进封装，藏于明处｜产业｜2026-09-21｜仅网络版 - 天下杂志
TSMC's Baipu Plan: Advanced Packaging, Hidden in Plain Sight｜Industry｜2026-09-21｜web only - 天下雜誌
- 资讯公开站google_news_tsmc
ASML与TSMC宣布率先推动行业向High-NA EUV大尺寸光掩模过渡
ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV - pr.tsmc.com
