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- 资讯公开站Semiconductor Engineering
Chip Industry Week In Review
$2B foundry pact; hyper-NA EUV; TSMC, Samsung financials; Canon readies nanoimprint; AI chips under scrutiny; $10T data center buildout; $1.5B SiC boost; chip smuggling; 800V power gains traction; quantum HW scales up; wireless EV road charging; sub-nm gate dielectrics; mobile fa