- 资讯公开站rss_bbc_business
工党主席称曼联亿万富翁老板在避税后失去道德高地
Billionaire Man United owner loses moral high ground after tax exile, Labour chair says
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英伟达CEO驳斥AI灭绝恐惧为“末日叙事”
Nvidia boss rejects AI extinction fears as 'doomsday narratives'
英伟达首席执行官黄仁勋对人工智能可能导致人类灭绝的担忧予以驳斥,称这类说法是“末日叙事”。此番表态是在人工智能研究人员警告该技术可能带来人类灭绝风险之后作出的。
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停止工作后你每年能拿到1.3万英镑吗?以下是查询方法
Will you get £13,000 a year when you stop working? Here's how to check
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美中在特朗普与习近平峰会前讨论人工智能安全计划
US and China discuss AI safety plan ahead of Trump-Xi summit
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加拿大部长告诉BBC:英国应与加拿大在新欧洲联盟中“联手”
UK should 'team up' with Canada in new Europe alliance, Canadian minister tells BBC
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保守党承诺恢复游客免税购物
Tories pledge to bring back tax-free shopping for tourists
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如果航班取消或延误,我有什么权利?
What are my rights if my flight is cancelled or delayed?
- 资讯公开站google_news_asml
CS - EUV培训中心台湾技术培训师 - 台南 - ASML
CS - EUV Training Center TW Technical Trainer - Tainan - ASML
- 资讯公开站google_news_tsmc
台积电拟在高雄建迷你循环以加速CoWoS设备验证,传考虑友达厂址用于CoPoS
[News] TSMC Plans Mini-Loop at Kaohsiung to Speed CoWoS Tool Validation; Reportedly Eyes AUO Site for CoPoS - TrendForce
TrendForce报道,台积电计划在高雄设立迷你循环(mini-loop),以加快CoWoS设备的验证流程。报道还称,台积电据传正考虑将友达(AUO)的厂址用于CoPoS。
- 资讯公开站google_news_tsmc
传 TSMC 1.4nm 节点宏大计划:四座工厂据称 2028 年第二季度投产,每片晶圆价格仅略高于 N2
TSMC Reportedly Has Grand Plans For Its 1.4nm Node With Four Plants Said To Be Operational By Q2 2028, Price Per Wafer Surprisingly Only Marginally Higher Than N2 - Wccftech
据 Wccftech 报道,TSMC 对其 1.4nm 节点有宏大计划,据称将建四座工厂,预计到 2028 年第二季度投入运营。报道称,该节点每片晶圆的价格令人意外地仅略高于 N2。
- 资讯公开站google_news_asml
关于 High NA EUV 光刻,你应该知道的 5 件事 - ASML
5 things you should know about High NA EUV lithography - ASML
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与魔法无异:EUV 薄膜——ASML 故事
Indistinguishable from magic: the EUV pellicle – Stories - ASML
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制造EUV:从实验室到晶圆厂——故事 - ASML
Making EUV: from lab to fab – Stories - ASML
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CS - EUV 技术支持工程师(功率性能)- 台南 - ASML
CS - EUV Technical Support Engineer (Power Performance) - Tainan - ASML
- 资讯公开站google_news_asml
客户支持 - EUV F20 计划员 - 新竹 - ASML
CS - EUV F20 Planner - Hsinchu - ASML
- 资讯公开站google_news_asml
High-NA EUV 迎来新就绪里程碑:首款高量产逻辑产品
High NA EUV reaches new readiness milestone with first high-volume Logic product - ASML
- 资讯公开站google_news_asml
台积电与ASML宣布合作推动High-NA EUV大尺寸光掩模行业转型
TSMC and ASML Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV - ASML
- 资讯公开站google_news_asml
英特尔代工与ASML合作加速High-NA EUV的行业准备
Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High-NA EUV - ASML
- 资讯公开站google_news_asml
升级安装与搬迁通用安装协调员 EUV - ASML
Upgrade Install and Relocation General Install Coordinator EUV - ASML
- 资讯公开站google_news_tsmc_site
CoWoS® - 台湾积体电路制造股份有限公司 - TSMC 3DFabric
CoWoS® - Taiwan Semiconductor Manufacturing Company Limited - TSMC 3DFabric
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TSMC 完成全球首个集成 JEDEC Wide I/O 移动 DRAM 接口的 CoWoS™ 测试芯片流片
TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS小芯片,面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing Hsinchu, Taiwan R.O.C. - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电 CoWoS 永续行动:废料变黄金,回收晶圆节省 7 亿新台币
TSMC's CoWoS® Sustainability Drive: Turning Waste into Wealth, Saving NT$700 Million with Recycled Wafers - TSMC
- 资讯公开站google_news_tsmc_site
先进有机中介层(CoWoS®-R)封装的可靠性表现 - TSMC
Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages - TSMC
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS®小芯片,面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing - pr.tsmc.com