- 资讯公开站google_news_asml
台积电与ASML宣布合作推动High-NA EUV大尺寸光掩模行业转型
TSMC and ASML Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV - ASML
- 资讯公开站google_news_asml
英特尔代工与ASML合作加速High-NA EUV的行业准备
Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High-NA EUV - ASML
- 资讯公开站google_news_asml
升级安装与搬迁通用安装协调员 EUV - ASML
Upgrade Install and Relocation General Install Coordinator EUV - ASML
- 资讯公开站google_news_tsmc_site
CoWoS® - 台湾积体电路制造股份有限公司 - TSMC 3DFabric
CoWoS® - Taiwan Semiconductor Manufacturing Company Limited - TSMC 3DFabric
- 资讯公开站google_news_tsmc_site
TSMC 完成全球首个集成 JEDEC Wide I/O 移动 DRAM 接口的 CoWoS™ 测试芯片流片
TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing Hsinchu, Taiwan R.O.C. - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电 CoWoS 永续行动：废料变黄金，回收晶圆节省 7 亿新台币
TSMC's CoWoS® Sustainability Drive: Turning Waste into Wealth, Saving NT$700 Million with Recycled Wafers - TSMC
- 资讯公开站google_news_tsmc_site
先进有机中介层（CoWoS®-R）封装的可靠性表现 - TSMC
Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages - TSMC
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS®小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电与博通以全球首款2倍光罩尺寸中介层增强CoWoS平台
TSMC and Broadcom Enhance the CoWoS Platform with World’s First 2X Reticle Size Interposer - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
TSMC 20nm与CoWoS™设计基础设施就绪
TSMC 20nm and CoWoS™ Design Infrastructure Ready|Taiwan Semiconductor Manufacturing Company Limited - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
CoWoS® - 台灣積體電路製造股份有限公司 - TSMC
- 资讯公开站google_news_tsmc_site
Xilinx 与 TSMC 基于 CoWoS 的全部 28nm 全可编程 3D IC 系列实现量产
Xilinx and TSMC Reach Volume Production on all 28nm CoWoS™-based All Programmable 3D IC Families - pr.tsmc.com
- 资讯公开站google_news_tsmc
传英特尔与台积电均有意拉拢台湾友达，先进封装话题带动股价放量大涨逾9%
Taiwan's AUO reportedly courted by both Intel and TSMC; advanced packaging buzz sends shares surging over 9% on heavy volume - finance.biggo.com
- 资讯公开站google_news_tsmc
AMD 通知合作伙伴涨价 10%，台积电晶圆成本上升或挤压 2026 年第四季度 Ryzen CPU 产品线
AMD Notifies Partners of 10% Price Hike As Increased TSMC Wafer Costs Could Squeeze Ryzen CPU Lineup For Q4 2026 - Wccftech
- 资讯公开站google_news_tsmc
台积电百埔计划：先进封装，藏于明处｜产业｜2026-09-21｜仅网络版 - 天下杂志
TSMC's Baipu Plan: Advanced Packaging, Hidden in Plain Sight｜Industry｜2026-09-21｜web only - 天下雜誌
- 资讯公开站google_news_tsmc
ASML与TSMC宣布率先推动行业向High-NA EUV大尺寸光掩模过渡
ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV - pr.tsmc.com
- 资讯公开站google_news_tsmc
台湾动工兴建以台积电为核心的先进封装园区
Taiwan breaks ground on advanced packaging park anchored by TSMC - TradingView
- 资讯公开站google_news_tsmc
台湾动工建设以台积电为核心的高级封装园区 - 路透社
Taiwan breaks ground on advanced packaging park anchored by TSMC - Reuters
- 资讯公开站nvidia_newsroom_rss
NVIDIA 在 IFA 2026 加速本地 AI 落地
Sparks Fly: NVIDIA Accelerates Local AI at IFA 2026
NVIDIA 与微软及合作伙伴在 IFA 2026 上联手，为 NVIDIA 硬件带来更快的本地推理与更易部署运行智能体的新工具，并推出紧凑型 RTX Spark 产品。
- 资讯公开站nvidia_newsroom_rss
d-Matrix 采用 NVIDIA NVLink Fusion 实现机架级 XPU 部署
d-Matrix Adopts NVIDIA NVLink Fusion for Rack-Scale XPU Deployment
AI 推理芯片厂商 d-Matrix 宣布将使用 NVIDIA NVLink Fusion，把其下一代 Raptor XPU 接入 NVIDIA AI 基础设施平台，成为该生态不断扩大的合作伙伴之一。
- 资讯公开站nvidia_newsroom_rss
NVIDIA 扩展开源 CUDA-Q 平台，面向容错量子计算
NVIDIA Expands Open Source CUDA-Q Platform for Fault-Tolerant Quantum Computing
NVIDIA 宣布扩展开源平台 CUDA-Q，新增 CUDA-Q Logical 编排层，为容错量子计算提供可编程、可验证的应用开发方式。
- 资讯公开站nvidia_newsroom_rss
NVIDIA Vera Rubin NVL72 首登 MLPerf Inference v6.1 即领先
NVIDIA Vera Rubin NVL72 Delivers Leading Performance in MLPerf Inference v6.1 Debut
系统性能、高效基础设施扩展与持续软件优化决定 AI 推理经济性。NVIDIA Vera Rubin NVL72 在 MLPerf Inference v6.1 首次亮相中展现出领先性能。
- 资讯公开站ScienceDaily Matter & Energy
加州理工突破将光纤性能带到硅芯片
Caltech breakthrough brings fiber-optic performance to silicon chips
加州理工学院科学家在硅芯片上制备出超低损耗光通路，效率接近光纤，在可见光波段性能显著优于现有技术，有望推动更强激光器、微型原子传感器与原子钟、量子系统及更节能数据中心的发展。
意义：若可见光波段低损耗光路可集成到硅芯片，将利好光子集成、量子器件与低功耗数据中心互连。
