- 资讯公开站Semiconductor Engineering
Crossing Chiplet Boundaries With PCIe Over UCIe
- 资讯公开站Semiconductor Engineering
LLM Performance And Acceleration: Part 1
- 资讯公开站Semiconductor Engineering
US Executive Order On Energy Grid Supply Chain Security
- 资讯公开站EE Times
Europe’s Space Industry Seeks Greater Supply Chain Control
- 资讯公开站Digitimes
Topco opens Fukuoka office to link Japan chip hubs
Topco Scientific said its Japanese subsidiary, Shunkawa, officially opened its Fukuoka office on October 1, making it the company’s third base in Japan alongside its Tokyo headquarters and Kumamoto office. The move…
- 资讯公开站Digitimes
ASE expands smart OSAT push with six university research partnerships
Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six Taiwanese universities as it works to …
- 资讯公开站Digitimes
Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity
Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction is intended to establish a new …
- 资讯公开站Digitimes
Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move
As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV) roadmaps on a unified 510×515…
- 资讯公开站Digitimes
Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion
China's rapid expansion of AI applications is driving a fresh wave of data center construction. SemiAnalysis estimates that the country has already delivered more than 24GW of data center capacity and will remain above t…
- 资讯公开站Digitimes
China's chip-tool localization accelerates: ACM Research backlog jumps 88%
ACM Research (Shanghai)'s order backlog has surged alongside China's semiconductor equipment expansion, giving the Shanghai-listed chip-tool maker a larger base of future deliveries while AI-related capacity investment a…
- 资讯公开站Digitimes
China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up
As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants—including Huawei, Cambricon, and Alibaba—are entering volume production. These chips are bein…
- 资讯公开站Digitimes
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced packaging.
- 资讯公开站Digitimes
Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years
Machvision said its "dual-track, four-line" strategy has entered an early growth phase as demand for AI servers, high-speed transmission, and advanced packaging continues to rise. The company said visibility for semicond…
- 资讯公开站Digitimes
MediaTek TPU orders rise as chip capacity war intensifies
MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers (CSPs) battle for semiconductor o…
- 资讯公开站Digitimes
Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking
Samsung Electronics brought global AI experts and researchers together in Seoul on September 30 for the Samsung AI Forum 2026, exploring how agentic AI and physical AI can deliver measurable business value across enterpr…
- 资讯公开站Digitimes
Tata Electronics leans on INR612.8 billion in guarantees to fund iPhone, chip expansion
Tata Electronics, Apple's contract manufacturing partner, provided INR612.8 billion (US$6.38 billion) in corporate guarantees on behalf of its subsidiaries in fiscal 2026 as it expanded iPhone manufacturing and semicondu…
- 论文公开站arXiv
半事实信用增强策略优化
Semifactual Credit-Augmented Policy Optimization
可验证奖励强化学习（RLVR）提升了 LLM 推理能力，但其预测仍对任务无关的提示特征敏感。本文通过半事实提示干预研究这种敏感性。
- 资讯公开站Digitimes
DIGITIMES：AI扩展正从芯片微缩转向系统集成
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
台积电表示，AI性能提升的下一阶段将更多依赖多芯片、内存与先进封装的系统级整合，而非单一芯片微缩，这可能重塑半导体竞争格局。
- 资讯公开站Digitimes
新加坡推出SG Semiconductor品牌，吸引芯片人才
SG Semiconductor builds brand and talent for Singapore chip industry
新加坡推出SG Semiconductor品牌以强化半导体形象并吸引人才，打造全球可识别的产业标识。A*STAR创新与企业副总裁Yee-Chia Yeo谈及此举。
- 资讯公开站Digitimes
黄仁勋获范弗里特奖，英伟达与韩国三巨头再聚首
Jensen Huang wins Van Fleet Award as Nvidia, South Korea trio reunites
英伟达CEO黄仁勋于当地时间9月28日在纽约出席韩国协会年度晚宴并获2026年范弗里特奖，三星电子会长李在镕和SK集团会长崔泰源到场祝贺。
- 资讯公开站Digitimes
AI热潮推动南台湾科学园区2026上半年营收突破1.7兆新台币
AI boom drives Southern Taiwan Science Park revenue past NT$1.7 trillion in 1H26
南台湾科学园区2026年上半年营收达1.77兆新台币（约556.6亿美元），同比增长28.57%，主要受全球AI热潮驱动。
- 资讯公开站Digitimes
台积电老将如何推动新加坡从实验室到晶圆厂的芯片战略
How a TSMC veteran is steering Singapore's lab-to-fab chip strategy
A*STAR创新与企业副总裁Yee-Chia Yeo于2022年返回新加坡，将多年行业经验转化为推动该国半导体研发与产业发展的战略。
- 资讯公开站gnews_tsmc_industry
富国银行看好台积电2nm扩产潜力，提振半导体设备前景
Wells Fargo Highlights TSMC's 2nm Expansion Potential, Boosting Semiconductor Equipment Outlook (TSM) - GuruFocus
- 资讯公开站Nature News
二维半导体有望加速高性能电子器件发展
2D semiconductor aims to turbocharge development of high-performance electronics
- 资讯公开站Semiconductor Engineering
E系列GPU IP：迈向融合加速的第一步
E-Series GPU IP: The First Step Towards Converged Acceleration
在单一灵活架构和可编程软件栈上融合图形、计算与AI，每核在1GHz下提供高达32 TOPS Int8算力，并可同时运行图形和AI工作负载。
