- 资讯公开站IEEE Spectrum
Engineering Multipole Resonances in Dielectric Metasurfaces for Transmission, Reflection, and Absorption Control
Dielectric metasurfaces have moved to the forefront of nanophotonics, offering flat, low-loss alternatives to conventional bulk optical elements for controlling the amplitude, phase, and polarization of light. These stru…
- 资讯公开站Semiconductor Engineering
The Proof Economy
- 资讯公开站Semiconductor Engineering
Chip Industry Week In Review
CFETs push scaling beyond 10 angstroms; physical AI M&A and funding; AI data centers drive new power/packaging investments; new Spectre-v2 attack targets JIT compilers; photonics moves closer to compute; quantum HW;…
- 资讯公开站Digitimes
Hitachi and Fanuc launch Physical AI partnership for factory automation
Hitachi and Fanuc announced on September 30, 2026, that they have formed a strategic partnership on Physical AI, with internal testing beginning immediately and customer promotion planned for fiscal 2027. The Japanese in…
- 资讯公开站Digitimes
Taiwan pledges to help TSMC expand domestic investment amid Singapore rumors
Rumors that TSMC is weighing a new semiconductor investment in Singapore have reignited concerns over its overseas expansion, while the Ministry of Economic Affairs (MOEA) said on October 2, 2026, that the government wil…
- 资讯公开站Digitimes
Inside Volantis's photonic bid to break AI's memory wall after US$88 million raise
Semiconductor startup Volantis has raised US$88 million in Series A funding to develop an AI inference architecture that uses photonic interconnect technology to address memory bottlenecks in AI chips. The round, announc…
- 资讯公开站Digitimes
China turns to 3D packaging to push AI performance beyond front-end scaling limits
Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have historically sat at the summit of se…
- 资讯公开站Digitimes
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced Semiconductor Engineering's (ASE's) e…
- 资讯公开站Digitimes
Taiwan government backs 7 semiconductor schools to upgrade equipment
To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme jointly supported by the National Develo…
- 资讯公开站Digitimes
JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support to help JCET scale its manufacturing f…
- 资讯公开站Digitimes
China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute
Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang raising his compensation claim from CNY4.29 billion (US$640 million) to C…
- 资讯公开站Digitimes
JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists
JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment Zone in Cheongju, North Chungcheong Prov…
- 资讯公开站Digitimes
TSMC, NTU deepen R&D ties through nearly 50 projects a year
National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening links among universities, industry…
- 资讯公开站Digitimes
Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED optical communications move clos…
- 资讯公开站Digitimes
Japan power semiconductor deal stalls as Rohm, Toshiba, Mitsubishi haggle
Japan's three major power semiconductor makers — Rohm Semiconductor, Toshiba, and Mitsubishi Electric — have failed to complete integration talks on the original schedule, as leadership disputes and a surge i…
- 资讯公开站Digitimes
Onsemi revises Synaptics takeover deal after rival bid
Onsemi has amended its agreement to buy Synaptics in an all-cash deal, a move that could reshape semiconductor competition and affect global technology supply chains. The revised cash transaction offers Synaptics shareho…
- 资讯公开站Digitimes
Nanya Technology wins approval for Southern 3D packaging plant
The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's plan to enter the Pingtung area…
- 资讯公开站Digitimes
Machvision expands early to chase NT$10B revenue
Machvision is expanding capacity earlier than planned to meet rising demand from semiconductors, substrates, and optical modules, while tight computer numerical control (CNC) and machining supply chains have emerged as i…
- 资讯公开站Semiconductor Engineering
The Hidden Challenges of Edge AI Design
- 资讯公开站Semiconductor Engineering
AI-Defined Vehicles Push Compute, Memory, And Validation Limits
- 资讯公开站Semiconductor Engineering
Turning Edge AI Data Into Real-Time Action
- 资讯公开站Semiconductor Engineering
Memory At The Edge: Non-Volatile Memory Challenges And Requirements For Humanoid Robots
- 资讯公开站Semiconductor Engineering
Open Security Foundations Are Only The Beginning: Deploying Caliptra Hardware in Production
- 资讯公开站Semiconductor Engineering
Why LLMs Are The Best Thing To Happen To Chip Design
- 资讯公开站Semiconductor Engineering
Mitigating Threats With Pre-Silicon Security Verification
