- 资讯公开站Ars Technica
谷歌分析师卧底潜入臭名昭著的供应链黑客团伙
An undercover Google analyst infiltrated a notorious supply-chain hacking gang
摘要显示，谷歌威胁情报团队称其一名卧底分析师成功打入供应链黑客团伙 TeamPCP 的核心圈子。该团伙以供应链攻击著称，此次渗透或为谷歌获取其攻击手法与运作内幕提供了直接情报。原文未披露渗透持续时间、具体行动细节及是否已配合执法机构。
意义：供应链攻击已成为软件生态的核心威胁，头部厂商主动渗透黑客组织意味着防御方情报战升级，开发者需关注后续披露的攻击手法与影响范围。
- 资讯公开站google_news_asml
关于 High NA EUV 光刻，你应该知道的 5 件事 - ASML
5 things you should know about High NA EUV lithography - ASML
- 资讯公开站google_news_asml
与魔法无异：EUV 薄膜——ASML 故事
Indistinguishable from magic: the EUV pellicle – Stories - ASML
- 资讯公开站google_news_asml
制造EUV：从实验室到晶圆厂——故事 - ASML
Making EUV: from lab to fab – Stories - ASML
- 资讯公开站google_news_asml
CS - EUV 技术支持工程师（功率性能）- 台南 - ASML
CS - EUV Technical Support Engineer (Power Performance) - Tainan - ASML
- 资讯公开站google_news_asml
客户支持 - EUV F20 计划员 - 新竹 - ASML
CS - EUV F20 Planner - Hsinchu - ASML
- 资讯公开站google_news_asml
High-NA EUV 迎来新就绪里程碑：首款高量产逻辑产品
High NA EUV reaches new readiness milestone with first high-volume Logic product - ASML
- 资讯公开站google_news_asml
台积电与ASML宣布合作推动High-NA EUV大尺寸光掩模行业转型
TSMC and ASML Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV - ASML
- 资讯公开站google_news_asml
英特尔代工与ASML合作加速High-NA EUV的行业准备
Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High-NA EUV - ASML
- 资讯公开站google_news_asml
升级安装与搬迁通用安装协调员 EUV - ASML
Upgrade Install and Relocation General Install Coordinator EUV - ASML
- 资讯公开站google_news_tsmc_site
CoWoS® - 台湾积体电路制造股份有限公司 - TSMC 3DFabric
CoWoS® - Taiwan Semiconductor Manufacturing Company Limited - TSMC 3DFabric
- 资讯公开站google_news_tsmc_site
TSMC 完成全球首个集成 JEDEC Wide I/O 移动 DRAM 接口的 CoWoS™ 测试芯片流片
TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing Hsinchu, Taiwan R.O.C. - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电 CoWoS 永续行动：废料变黄金，回收晶圆节省 7 亿新台币
TSMC's CoWoS® Sustainability Drive: Turning Waste into Wealth, Saving NT$700 Million with Recycled Wafers - TSMC
- 资讯公开站google_news_tsmc_site
先进有机中介层（CoWoS®-R）封装的可靠性表现 - TSMC
Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages - TSMC
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS®小芯片，面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电与博通以全球首款2倍光罩尺寸中介层增强CoWoS平台
TSMC and Broadcom Enhance the CoWoS Platform with World’s First 2X Reticle Size Interposer - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
TSMC 20nm与CoWoS™设计基础设施就绪
TSMC 20nm and CoWoS™ Design Infrastructure Ready|Taiwan Semiconductor Manufacturing Company Limited - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
CoWoS® - 台灣積體電路製造股份有限公司 - TSMC
- 资讯公开站google_news_tsmc_site
Xilinx 与 TSMC 基于 CoWoS 的全部 28nm 全可编程 3D IC 系列实现量产
Xilinx and TSMC Reach Volume Production on all 28nm CoWoS™-based All Programmable 3D IC Families - pr.tsmc.com
- 资讯公开站google_news_tsmc
联发科推出采用台积电最先进技术的新款移动芯片 - 路透社
MediaTek launches new mobile chip using TSMC's most advanced technology - Reuters
- 资讯公开站google_news_tsmc
传英特尔与台积电均有意拉拢台湾友达，先进封装话题带动股价放量大涨逾9%
Taiwan's AUO reportedly courted by both Intel and TSMC; advanced packaging buzz sends shares surging over 9% on heavy volume - finance.biggo.com
- 资讯公开站google_news_tsmc
AMD 通知合作伙伴涨价 10%，台积电晶圆成本上升或挤压 2026 年第四季度 Ryzen CPU 产品线
AMD Notifies Partners of 10% Price Hike As Increased TSMC Wafer Costs Could Squeeze Ryzen CPU Lineup For Q4 2026 - Wccftech
- 资讯公开站google_news_tsmc
台积电百埔计划：先进封装，藏于明处｜产业｜2026-09-21｜仅网络版 - 天下杂志
TSMC's Baipu Plan: Advanced Packaging, Hidden in Plain Sight｜Industry｜2026-09-21｜web only - 天下雜誌
- 资讯公开站google_news_tsmc
ASML与TSMC宣布率先推动行业向High-NA EUV大尺寸光掩模过渡
ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV - pr.tsmc.com
