- 资讯公开站google_news_tsmc
传 TSMC 1.4nm 节点宏大计划:四座工厂据称 2028 年第二季度投产,每片晶圆价格仅略高于 N2
TSMC Reportedly Has Grand Plans For Its 1.4nm Node With Four Plants Said To Be Operational By Q2 2028, Price Per Wafer Surprisingly Only Marginally Higher Than N2 - Wccftech
据 Wccftech 报道,TSMC 对其 1.4nm 节点有宏大计划,据称将建四座工厂,预计到 2028 年第二季度投入运营。报道称,该节点每片晶圆的价格令人意外地仅略高于 N2。
- 资讯公开站Ars Technica
谷歌分析师卧底潜入臭名昭著的供应链黑客团伙
An undercover Google analyst infiltrated a notorious supply-chain hacking gang
摘要显示,谷歌威胁情报团队称其一名卧底分析师成功打入供应链黑客团伙 TeamPCP 的核心圈子。该团伙以供应链攻击著称,此次渗透或为谷歌获取其攻击手法与运作内幕提供了直接情报。原文未披露渗透持续时间、具体行动细节及是否已配合执法机构。
意义:供应链攻击已成为软件生态的核心威胁,头部厂商主动渗透黑客组织意味着防御方情报战升级,开发者需关注后续披露的攻击手法与影响范围。
- 资讯公开站google_news_asml
关于 High NA EUV 光刻,你应该知道的 5 件事 - ASML
5 things you should know about High NA EUV lithography - ASML
- 资讯公开站google_news_asml
与魔法无异:EUV 薄膜——ASML 故事
Indistinguishable from magic: the EUV pellicle – Stories - ASML
- 资讯公开站google_news_asml
制造EUV:从实验室到晶圆厂——故事 - ASML
Making EUV: from lab to fab – Stories - ASML
- 资讯公开站google_news_asml
CS - EUV 技术支持工程师(功率性能)- 台南 - ASML
CS - EUV Technical Support Engineer (Power Performance) - Tainan - ASML
- 资讯公开站google_news_asml
客户支持 - EUV F20 计划员 - 新竹 - ASML
CS - EUV F20 Planner - Hsinchu - ASML
- 资讯公开站google_news_asml
High-NA EUV 迎来新就绪里程碑:首款高量产逻辑产品
High NA EUV reaches new readiness milestone with first high-volume Logic product - ASML
- 资讯公开站google_news_asml
台积电与ASML宣布合作推动High-NA EUV大尺寸光掩模行业转型
TSMC and ASML Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV - ASML
- 资讯公开站google_news_asml
英特尔代工与ASML合作加速High-NA EUV的行业准备
Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High-NA EUV - ASML
- 资讯公开站google_news_asml
升级安装与搬迁通用安装协调员 EUV - ASML
Upgrade Install and Relocation General Install Coordinator EUV - ASML
- 资讯公开站google_news_tsmc_site
CoWoS® - 台湾积体电路制造股份有限公司 - TSMC 3DFabric
CoWoS® - Taiwan Semiconductor Manufacturing Company Limited - TSMC 3DFabric
- 资讯公开站google_news_tsmc_site
TSMC 完成全球首个集成 JEDEC Wide I/O 移动 DRAM 接口的 CoWoS™ 测试芯片流片
TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS小芯片,面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing Hsinchu, Taiwan R.O.C. - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电 CoWoS 永续行动:废料变黄金,回收晶圆节省 7 亿新台币
TSMC's CoWoS® Sustainability Drive: Turning Waste into Wealth, Saving NT$700 Million with Recycled Wafers - TSMC
- 资讯公开站google_news_tsmc_site
先进有机中介层(CoWoS®-R)封装的可靠性表现 - TSMC
Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages - TSMC
- 资讯公开站google_news_tsmc_site
Arm与TSMC展示业界首款7nm基于Arm的CoWoS®小芯片,面向高性能计算
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
台积电与博通以全球首款2倍光罩尺寸中介层增强CoWoS平台
TSMC and Broadcom Enhance the CoWoS Platform with World’s First 2X Reticle Size Interposer - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
TSMC 20nm与CoWoS™设计基础设施就绪
TSMC 20nm and CoWoS™ Design Infrastructure Ready|Taiwan Semiconductor Manufacturing Company Limited - pr.tsmc.com
- 资讯公开站google_news_tsmc_site
CoWoS® - 台灣積體電路製造股份有限公司 - TSMC
- 资讯公开站google_news_tsmc_site
Xilinx 与 TSMC 基于 CoWoS 的全部 28nm 全可编程 3D IC 系列实现量产
Xilinx and TSMC Reach Volume Production on all 28nm CoWoS™-based All Programmable 3D IC Families - pr.tsmc.com
- 资讯公开站google_news_tsmc
联发科推出采用台积电最先进技术的新款移动芯片 - 路透社
MediaTek launches new mobile chip using TSMC's most advanced technology - Reuters
- 资讯公开站google_news_tsmc
传英特尔与台积电均有意拉拢台湾友达,先进封装话题带动股价放量大涨逾9%
Taiwan's AUO reportedly courted by both Intel and TSMC; advanced packaging buzz sends shares surging over 9% on heavy volume - finance.biggo.com
- 资讯公开站google_news_tsmc
AMD 通知合作伙伴涨价 10%,台积电晶圆成本上升或挤压 2026 年第四季度 Ryzen CPU 产品线
AMD Notifies Partners of 10% Price Hike As Increased TSMC Wafer Costs Could Squeeze Ryzen CPU Lineup For Q4 2026 - Wccftech
- 资讯公开站google_news_tsmc
台积电百埔计划:先进封装,藏于明处|产业|2026-09-21|仅网络版 - 天下杂志
TSMC's Baipu Plan: Advanced Packaging, Hidden in Plain Sight|Industry|2026-09-21|web only - 天下雜誌