- 资讯公开站Digitimes
China AI infrastructure spreads to mid-sized firms
China's AI investment is increasingly turning into server purchases and data center construction, and the wave that began with large tech companies is now spreading to mid-sized firms. South Korean media say the expandin…
- 资讯公开站Digitimes
China financing chain linked to Nvidia Blackwell chips, 32 Asus servers exposed
A China-backed leasing firm appears to have helped Chinese companies buy restricted Nvidia Blackwell platform chips through financial leasing, according to a recent report. The transactions involved 32 Asus servers equip…
- 资讯公开站Digitimes
UNEEC shifts ODM focus to racks as L11 rises to 18%
Chenming Electronic Tech (UNEEC) president Charles Lo said the fourth quarter is a traditional peak season and that new models such as VR200 will enter mass production in the fourth quarter, helping revenue recover towar…
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TSMC mulls multi-fab Texas campus beyond Arizona, with Singapore also in talks
TSMC is reportedly weighing a new manufacturing campus in Texas that could add tens of billions of dollars to its US expansion, potentially creating a second major American production hub alongside Arizona as AI chip dem…
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Taiwan government backs 7 semiconductor schools to upgrade equipment
To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme jointly supported by the National Develo…
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JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support to help JCET scale its manufacturing f…
- 资讯公开站Digitimes
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply current into the thousands of ampe…
- 资讯公开站Digitimes
Micron expands global fabs, calls on Taiwanese suppliers to go overseas
AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India. Donghui Lu, vice president of Micron's …
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Micron eyes NVHBM profits with TSMC custom HBM push
Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can unlock added value even when manufact…
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Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop
When the underlying economics of infrastructure commitments meet the financing muscle of the companies supplying foundational compute, the traditional boundary between supplier and customer begins to blur.
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China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute
Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang raising his compensation claim from CNY4.29 billion (US$640 million) to C…
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JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists
JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment Zone in Cheongju, North Chungcheong Prov…
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Column: AI benchmarks remain lucrative business
New AI models arrive every few weeks, and the question of which is better often comes down to the leaderboard. Behind those rankings, evaluation can look like an academic exercise in setting rules, running tests, and ass…
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TSMC, NTU deepen R&D ties through nearly 50 projects a year
National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening links among universities, industry…
- 资讯公开站Digitimes
Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED optical communications move clos…
- 资讯公开站Digitimes
FAW, GAC formalize partnership as Toyota's China joint ventures face possible overhaul
China's state-owned FAW and GAC's controlling shareholder, Guangzhou Automobile Industry Group, have signed a strategic cooperation framework that could reshape Toyota's long-standing two-joint-venture model in the count…
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Hygon, Sugon deepen integration under one chairman after US$17.3B merger collapse
Chinese AI chipmaker Hygon Information Technology has appointed Jun Li as its new chairman following a recent board reshuffle. Li only took over as chairman of Chinese server maker Dawning Information Industry (Sugon) in…
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Samsung launches Tab S12, Buds On, SmartTag3
Samsung Electronics on October 1 unveiled its next-generation premium Galaxy Tab S12 series, its first clip-on wireless earbuds, the Galaxy Buds On, and the Galaxy SmartTag3, which expands iOS support. The three product …
- 资讯公开站Digitimes
Japan power semiconductor deal stalls as Rohm, Toshiba, Mitsubishi haggle
Japan's three major power semiconductor makers — Rohm Semiconductor, Toshiba, and Mitsubishi Electric — have failed to complete integration talks on the original schedule, as leadership disputes and a surge i…
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Chinese automakers' shift to the US may reshape supply chains and supplier margins
Hiroca said two major Chinese automakers are likely to build factories in the US, a move that could redraw supply chains across North America, alter supplier demand patterns, and deepen pressure on parts makers already f…
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SK Hynix says Solidigm IPO remains undecided as AI storage demand drives investment
SK Hynix has reiterated that no decision has been made on a potential US initial public offering (IPO) or other external financing for its Solidigm subsidiary, as the company weighs investment needs driven by growing dem…
- 资讯公开站Digitimes
Wi-Fi 8 races ahead of the standard, putting networking chips on a faster 2027 growth track
Wi-Fi 8 adoption is accelerating well ahead of the standard's expected finalization in the first half of 2028, with device brands and chipmakers already moving into early commercial deployment. The first Wi-Fi 8 routers …
- 资讯公开站Digitimes
Toshiba reportedly to double HDD production as AI drives storage demand
Toshiba plans to double production capacity for hard disk drives (HDDs) used in AI data centers by fiscal 2027, investing about JPY60 billion (US$379.4 million) to expand its Philippine operations, according to Nikkei As…
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Meta hires MongoDB CEO to lead AI enterprise platform
Meta has launched a new business unit, "Meta Enterprise Platform," to package its artificial intelligence (AI) models, agent tools, and infrastructure for enterprise customers, and has tapped MongoDB chief executive CJ D…
- 资讯公开站Digitimes
Climax Technology sets up AI center, targets 3Q27 sampling
Wireless communications company Climax Technology is accelerating its AI push by launching an "AI and Advanced Technology Center," with its first project a next-generation AI sensing platform slated for sampling in the t…
