2026年10月2日

Micron ramps up HBM capacity at Taiwan's four major sites

Micron Technology's revenue and profit for the fourth quarter of fiscal 2026 both beat expectations, and the company expects capacity supply to be even tighter in 2027 and 2028 than in 2026. Donghui Lu, vice president of…

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Nidec impairment loss far exceeds estimates as auditor withholds opinion

Japanese motor and electronic components maker Nidec said on September 30 that its long-delayed consolidated financial report for fiscal year 2025 (from April 2025 to March 2026) showed losses from accounting irregularit…

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LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals

South Korea's LG Electronics and LS Electric are expanding deeper into AI data center infrastructure, targeting two of the fastest-growing bottlenecks around high-density computing: cooling and power delivery. LG is addi…

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Hiroca targets Tier 1 shift, global capacity overhaul

Auto components maker Hiroca posted a pre-tax loss of NT$146 million (US$4.57 million) in the first half of 2026, owing to weak demand in China's auto market and a number of one-time factors. However, during its earnings…

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California tech exec arrested in US$300M Nvidia AI server smuggling case

US federal prosecutors on October 1 arrested a 38-year-old California man accused of violating US export controls by smuggling computer servers containing US$300 million worth of Nvidia artificial intelligence chips to C…

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ASE stake, expansion open doors for Machvision

AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced Semiconductor Engineering's (ASE's) e…

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Avaota F2 – Allwinner V861 RISC-V SBC targets AI cameras with PTZ and audio support

Avaota F2 is the first SBC based on an Allwinner V861 dual-core 64-bit RISC-V SoC with 128MB on-chip DDR3 memory, support for 4K cameras, H.265 video codec, and a 1 TOPS AI accelerator. It’s an update to the earlie…

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Fu-Gen, Nala Renewables close 100MW BESS deal in Finland

Fu-Gen has sold a 100MW ready-to-build battery storage project in Finland to Nala Renewables, extending their Nordic BESS pipeline to 275MW.

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New South Wales grants approval to BayWa r.e.’s Bullawah hybrid wind and battery project in Australia

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AMD bets on AI demand by buying World Labs

Under Lisa Su's 12-year tenure at Advanced Micro Devices (AMD), the company has gradually moved beyond its role as Intel's challenger in the CPU market. But in the accelerator market for training and running AI models, o…

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Tesla cuts AI5, AI6 memory specs to protect Optimus

Facing a prolonged memory supply crunch, Tesla CEO Elon Musk has announced steep cuts to the memory specifications of the company's AI5 and AI6 chips to secure enough memory for Optimus mass production. Musk said the dow…

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Huawei turns to LogicFolding to keep its flagship chip race alive

Huawei Technologies has unveiled its Mate 90 smartphone series, expanding the use of self-developed Kirin processors and HarmonyOS 7 as it looks to sustain flagship performance under US restrictions on access to advanced…

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Google's first Suncatcher satellite reaches orbit to test AI chips in space

Google has moved its orbital AI data center ambitions from paper to hardware. A prototype satellite carrying the company's Tensor Processing Units (TPUs) reached orbit on October 1, 2026, and the data it returns over the…

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China AI infrastructure spreads to mid-sized firms

China's AI investment is increasingly turning into server purchases and data center construction, and the wave that began with large tech companies is now spreading to mid-sized firms. South Korean media say the expandin…

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China financing chain linked to Nvidia Blackwell chips, 32 Asus servers exposed

A China-backed leasing firm appears to have helped Chinese companies buy restricted Nvidia Blackwell platform chips through financial leasing, according to a recent report. The transactions involved 32 Asus servers equip…

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UNEEC shifts ODM focus to racks as L11 rises to 18%

Chenming Electronic Tech (UNEEC) president Charles Lo said the fourth quarter is a traditional peak season and that new models such as VR200 will enter mass production in the fourth quarter, helping revenue recover towar…

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TSMC mulls multi-fab Texas campus beyond Arizona, with Singapore also in talks

TSMC is reportedly weighing a new manufacturing campus in Texas that could add tens of billions of dollars to its US expansion, potentially creating a second major American production hub alongside Arizona as AI chip dem…

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Taiwan government backs 7 semiconductor schools to upgrade equipment

To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme jointly supported by the National Develo…

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JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities

JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support to help JCET scale its manufacturing f…

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DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide

Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply current into the thousands of ampe…

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Micron expands global fabs, calls on Taiwanese suppliers to go overseas

AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India. Donghui Lu, vice president of Micron's …

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Micron eyes NVHBM profits with TSMC custom HBM push

Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can unlock added value even when manufact…

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Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop

When the underlying economics of infrastructure commitments meet the financing muscle of the companies supplying foundational compute, the traditional boundary between supplier and customer begins to blur.

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China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute

Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang raising his compensation claim from CNY4.29 billion (US$640 million) to C…

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JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists

JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment Zone in Cheongju, North Chungcheong Prov…

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